|
Base Material |
Epoxy,Teflon, Kapton Polyimide, PPE etc. |
|
Layer Count |
1-6 Layer Flex and Rigid Flex |
|
Dimension of Finished Board |
250* 400mm |
|
Surface Treatment |
HASL,Carbon Printing,Hard /Soft Gold,Tin/Lead Electroplating,Immersion Gold ect. |
|
Thickness of Base Copper |
1/3oz–1oz |
|
Dielectric Thickness |
1/2mil -3mil |
|
Diameter of Finished Hole ( min.) |
0.25mm |
|
Hole Diameter ( minimum ) |
0.20mm |
|
Hole Plating Aspect Ratio |
7:1 |
|
PTH Wall Thickness |
≥0.015mm |
|
Solder Mask Thickness (min.) |
7.6um (line angle) |
|
Tolerance of Punch Hole Diameter |
±0.05mm |
|
Outline Tolerance (Fine Steel Mould) |
± 2mil( ±0.05mm) |
|
Impedance Tolerance of Finished Board (Minimum) |
± 10% |
|
Circumference Void Test Voltage |
200 ± 5V |
|
Short-Circuited Resistance |
10M Ω |
|
Open-Circuited Resistance |
30 Ω |
|
Solderability Test |
260 ±10 ℃, Time: 10Sec |
Flex PCB
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